Advanced Wafer Holding Technology
Silicet’s Electroplating Wafer Holders provide a comprehensive solution for safe substrate handling during electroplating processes. These innovative holders feature a dry contact system that ensures secure holding and sealing with 3 mm edge exclusion, delivering full scope contacting without electrolyte contact.
Superior Design Features
The holders are engineered for simple substrate replacement in seconds, accommodating wafer thickness tolerances of ±100µ. For applications requiring higher tolerances, compensation is achieved by using a foil. The robust construction ensures reliable performance across various electroplating applications.
Flexible Material Options
Standard materials include PP or PEEK, with Teflon and other materials available on request. Flexholders for different wafer thicknesses are possible, providing maximum versatility for diverse application requirements.
Comprehensive Size Range
Available in standard sizes including 1, 2, 3, 4, 5, 6, 8 & 12 inch configurations. Other sizes and forms are available to meet specific customer requirements. Optional electrode installation to the holder provides additional functionality when needed.